TW277152B - - Google Patents
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- TW277152B TW277152B TW084104387A TW84104387A TW277152B TW 277152 B TW277152 B TW 277152B TW 084104387 A TW084104387 A TW 084104387A TW 84104387 A TW84104387 A TW 84104387A TW 277152 B TW277152 B TW 277152B
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- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000002165 photosensitisation Effects 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920000962 poly(amidoamine) Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000005180 public health Effects 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000005070 ripening Effects 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- KBPHJBAIARWVSC-XQIHNALSSA-N trans-lutein Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/C1=C(C)CC(O)CC1(C)C)C=CC=C(/C)C=CC2C(=CC(O)CC2(C)C)C KBPHJBAIARWVSC-XQIHNALSSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009692 water atomization Methods 0.000 description 1
- FJHBOVDFOQMZRV-XQIHNALSSA-N xanthophyll Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/C1=C(C)CC(O)CC1(C)C)C=CC=C(/C)C=CC2C=C(C)C(O)CC2(C)C FJHBOVDFOQMZRV-XQIHNALSSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0233—Deformable particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09633694A JP3812682B2 (ja) | 1994-05-10 | 1994-05-10 | 異方導電性樹脂フィルム状成形物の製造法 |
| JP09633794A JP3783785B2 (ja) | 1994-05-10 | 1994-05-10 | 異方導電性樹脂フィルム状接着材の製造法及び微細回路間の接続方法 |
| JP09633894A JP3786214B2 (ja) | 1994-05-10 | 1994-05-10 | 異方導電性樹脂フィルム状成形物の製法 |
| JP20971494A JP3360772B2 (ja) | 1994-09-02 | 1994-09-02 | 微細電極の接続構造および微細電極を持つ電子部品の検査方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW277152B true TW277152B (en]) | 1996-06-01 |
Family
ID=27468426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084104387A TW277152B (en]) | 1994-05-10 | 1995-05-02 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6042894A (en]) |
| EP (1) | EP0691660B1 (en]) |
| KR (2) | KR100377603B1 (en]) |
| CN (2) | CN1230834C (en]) |
| DE (1) | DE69535293T2 (en]) |
| TW (1) | TW277152B (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9905327B2 (en) | 2015-11-20 | 2018-02-27 | Industrial Technology Research Institute | Metal conducting structure and wiring structure |
| TWI668711B (zh) * | 2018-09-14 | 2019-08-11 | 瑋鋒科技股份有限公司 | 單層粒子導電彈性體及其製作方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5851644A (en) * | 1995-08-01 | 1998-12-22 | Loctite (Ireland) Limited | Films and coatings having anisotropic conductive pathways therein |
| US5916641A (en) * | 1996-08-01 | 1999-06-29 | Loctite (Ireland) Limited | Method of forming a monolayer of particles |
| US6402876B1 (en) | 1997-08-01 | 2002-06-11 | Loctite (R&D) Ireland | Method of forming a monolayer of particles, and products formed thereby |
| EP0855049B1 (en) | 1996-08-01 | 2005-11-09 | Loctite (Ireland) Limited | A method of forming a monolayer of particles, and products formed thereby |
| US6977025B2 (en) | 1996-08-01 | 2005-12-20 | Loctite (R&D) Limited | Method of forming a monolayer of particles having at least two different sizes, and products formed thereby |
| JP3928753B2 (ja) * | 1996-08-06 | 2007-06-13 | 日立化成工業株式会社 | マルチチップ実装法、および接着剤付チップの製造方法 |
| TW560535U (en) * | 1997-02-27 | 2003-11-01 | Seiko Epson Corp | Adhesive, liquid crystal device and electronic apparatus |
| KR100643640B1 (ko) * | 1997-02-27 | 2007-06-07 | 세이코 엡슨 가부시키가이샤 | 접속구조체,액정장치,전자기기와이방도전성접착제및그제조방법 |
| JPH11289103A (ja) * | 1998-02-05 | 1999-10-19 | Canon Inc | 半導体装置および太陽電池モジュ―ル及びその解体方法 |
| DE19957609A1 (de) * | 1998-12-30 | 2000-07-06 | Giesecke & Devrient Gmbh | Verfahren zum Herstellen einer zugleich haftenden und elektrisch leitfähigen Verbindung zwischen einem Modul und einem elektronischen Bauelement |
| JP2001031929A (ja) * | 1999-07-21 | 2001-02-06 | Sony Chem Corp | 接続構造体 |
| JP2001184618A (ja) * | 1999-12-24 | 2001-07-06 | Hitachi Ltd | 磁気ディスク装置 |
| US6569494B1 (en) | 2000-05-09 | 2003-05-27 | 3M Innovative Properties Company | Method and apparatus for making particle-embedded webs |
| US20020119255A1 (en) | 2000-05-09 | 2002-08-29 | Ranjith Divigalpitiya | Method and apparatus for making particle-embedded webs |
| WO2002050613A2 (en) * | 2000-12-18 | 2002-06-27 | The University Of Vermont And State Agricultural College | Method of curing a photosensitive material using evanescent wave energy |
| JPWO2003003798A1 (ja) * | 2001-06-29 | 2004-10-21 | 東レエンジニアリング株式会社 | 異方導電性接着剤を用いた接合方法 |
| US20030017272A1 (en) * | 2001-07-20 | 2003-01-23 | Stevenson Michael J. | Bonding of granular materials to polyolefin surfaces |
| US6603080B2 (en) | 2001-09-27 | 2003-08-05 | Andrew Corporation | Circuit board having ferrite powder containing layer |
| US6685988B2 (en) * | 2001-10-09 | 2004-02-03 | Delphi Technologies, Inc. | Kinetic sprayed electrical contacts on conductive substrates |
| BR0212806A (pt) * | 2001-10-19 | 2004-08-24 | Atofina | Processo de fabricação de pelìculas através de co-extrusão por molde de sopro |
| WO2003061949A1 (en) * | 2002-01-18 | 2003-07-31 | Avery Dennison Corporation | Sheet having microsized architecture |
| WO2003062133A2 (en) * | 2002-01-18 | 2003-07-31 | Avery Dennison Corporation | Covered microchamber structures |
| US20030155656A1 (en) * | 2002-01-18 | 2003-08-21 | Chiu Cindy Chia-Wen | Anisotropically conductive film |
| JP4148685B2 (ja) * | 2002-02-18 | 2008-09-10 | ソニーケミカル＆インフォメーションデバイス株式会社 | 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤 |
| KR100694529B1 (ko) * | 2002-03-25 | 2007-03-13 | 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 | 전기전도성 입자 및 접착제 |
| EP1615978B1 (en) | 2003-04-10 | 2007-05-09 | 3M Innovative Properties Company | Heat-activatable adhesive |
| US7034403B2 (en) | 2003-04-10 | 2006-04-25 | 3M Innovative Properties Company | Durable electronic assembly with conductive adhesive |
| SE0301592D0 (sv) * | 2003-05-28 | 2003-05-28 | Amersham Biosciences Ab | Electrophoretic support |
| EP1662614A4 (en) * | 2003-09-01 | 2008-01-23 | Jsr Corp | ANISOTROPIC CONDUCTIVE SHEET, PROCESS FOR PRODUCING SAME, AND CIRCUIT BOARD INSPECTION APPARATUS |
| US7432124B2 (en) * | 2003-11-04 | 2008-10-07 | 3M Innovative Properties Company | Method of making an organic light emitting device |
| US7271534B2 (en) * | 2003-11-04 | 2007-09-18 | 3M Innovative Properties Company | Segmented organic light emitting device |
| TWI236329B (en) * | 2003-12-25 | 2005-07-11 | Au Optronics Corp | Printed circuit board of display for preventing accumulation of thermal expansion |
| US20100025089A1 (en) * | 2004-01-07 | 2010-02-04 | Jun Taketatsu | Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof |
| TWI239574B (en) | 2004-03-18 | 2005-09-11 | Ind Tech Res Inst | The method of conductive particles dispersing |
| KR100597391B1 (ko) * | 2004-05-12 | 2006-07-06 | 제일모직주식회사 | 절연 전도성 미립자 및 이를 함유하는 이방 전도성 접착필름 |
| DE102004029589A1 (de) * | 2004-06-18 | 2005-12-29 | Tesa Ag | Elektrisch anisotrop leitfähiger Schmelzkleber zur Implantierung von elektrischen Modulen in einen Kartenkörper |
| US7078095B2 (en) * | 2004-07-07 | 2006-07-18 | Xerox Corporation | Adhesive film exhibiting anisotropic electrical conductivity |
| JP4554330B2 (ja) * | 2004-10-21 | 2010-09-29 | 株式会社リコー | 高耐久性を有する断熱スタンパ構造 |
| TWI323901B (en) * | 2004-11-26 | 2010-04-21 | Hon Hai Prec Ind Co Ltd | Anisotropic conductive material |
| CN102796486B (zh) * | 2005-03-16 | 2014-04-16 | 日立化成株式会社 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
| DE102005020689B3 (de) * | 2005-05-03 | 2006-07-06 | Siemens Ag | Verfahren zur Herstellung einer Isolierplatte |
| KR100731667B1 (ko) | 2005-05-10 | 2007-06-22 | 히다치 가세고교 가부시끼가이샤 | 이방도전 필름 및 이를 이용한 회로판 |
| US8802214B2 (en) | 2005-06-13 | 2014-08-12 | Trillion Science, Inc. | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
| US20060280912A1 (en) * | 2005-06-13 | 2006-12-14 | Rong-Chang Liang | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
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- 1995-05-09 KR KR1019950011298A patent/KR100377603B1/ko not_active Expired - Fee Related
- 1995-05-10 DE DE69535293T patent/DE69535293T2/de not_active Expired - Lifetime
- 1995-05-10 EP EP95303147A patent/EP0691660B1/en not_active Expired - Lifetime
- 1995-05-10 CN CNB021593922A patent/CN1230834C/zh not_active Expired - Fee Related
- 1995-05-10 CN CN95105708A patent/CN1118832C/zh not_active Expired - Fee Related
-
1997
- 1997-07-09 US US08/890,342 patent/US6042894A/en not_active Expired - Lifetime
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2002
- 2002-07-29 KR KR1020020044740A patent/KR100377992B1/ko not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9905327B2 (en) | 2015-11-20 | 2018-02-27 | Industrial Technology Research Institute | Metal conducting structure and wiring structure |
| TWI668711B (zh) * | 2018-09-14 | 2019-08-11 | 瑋鋒科技股份有限公司 | 單層粒子導電彈性體及其製作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1492449A (zh) | 2004-04-28 |
| EP0691660B1 (en) | 2006-11-15 |
| DE69535293T2 (de) | 2007-04-19 |
| KR100377603B1 (ko) | 2003-11-17 |
| KR100377992B1 (ko) | 2003-03-29 |
| DE69535293D1 (de) | 2006-12-28 |
| EP0691660A1 (en) | 1996-01-10 |
| CN1115485A (zh) | 1996-01-24 |
| CN1118832C (zh) | 2003-08-20 |
| US6042894A (en) | 2000-03-28 |
| CN1230834C (zh) | 2005-12-07 |
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